Microvia
In the course of miniaturisation on the PCB, the use of standard technology means that the limits of feasibility are often reached. Indeed, it is frequently the case that a reduction in the path widths of the conductors and their minimum spacing, or of the mechanical drillings and their residual rings is insufficient. As a conventional via passing through the PCB on any layer has a major space requirement, room can be saved by means of blind hole and microvia technology. Microvias only need roughly a quarter of the surface area of drilled vias and as blind holes they only occupy space on the contacted layers.
Contact: Norbert Redl, Phone +43 2985 2141-240
Advantages of MV technology
- Quicker clarification of the PCB layout (cost reduction)
- A reduction in the number of layers
- Shorter conductor lengths and improved unit EMC behaviour
- A reduction in assembly costs due to component density on one side
- Extensive room for EMC measures and shielded areas through a smaller conductor space requirement on the top and bottom sides
Häusermann product range
- Microvias
- Blind vias
- Buried vias
Materials and copper laminations
- FR4, Tg 135°C
- FR4, Tg 150°C
- Copper thicknesses for outer layers: 35 - 140µm
- Copper thicknesses for inner layers: 18 - 105µm


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