Microvia

In the course of miniaturisation on the PCB, the use of standard technology means that the limits of feasibility are often reached. Indeed, it is frequently the case that a reduction in the path widths of the conductors and their minimum spacing, or of the mechanical drillings and their residual rings is insufficient. As a conventional via passing through the PCB on any layer has a major space requirement, room can be saved by means of blind hole and microvia technology. Microvias only need roughly a quarter of the surface area of drilled vias and as blind holes they only occupy space on the contacted layers.

• Quicker clarification of the PCB layout (cost reduction)
  
• A reduction in the number of layers
  
• Shorter conductor lengths and improved unit EMC behaviour
  
• A reduction in assembly costs due to component density on one side
  
• Extensive room for EMC measures and shielded areas through a smaller conductor space requirement on the top and bottom sides

• Microvias
  
• Blind vias
  
• Buried vias
  

• FR4, Tg 135°C
  
• FR4, Tg 150°C

• Copper thicknesses for outer layers: 35 - 140µm
  
• Copper thicknesses for inner layers: 18 - 105µm