High current and heat management on PCBs

Modern electronics calls for modern components and innovative technologies. HSMtec ist the answer to the high demands of ground-breaking industries like light technology (LED) and drive or power electronics. The components are available from prototypes to large-scale production.

HSMtec for light requirements

HSMtec brings your assemblies and thus your entire system to the level of maximum performance.

With the HSMtec technology, the heat loss of modern power assemblies (high brightness LEDs, IGBT, MOSFET, etc.) is dissipated safely and directly via the PCB.

HSMtec for high current requirements

HSMtec provides more functionality and space.
These boards combine control and power electronics on a single board.

HSMtec for multidimensional requirements

HSMtec is the new era of multidimensional LED and high current PCBs.

HSMtec works without additional cable or connector systems opening up attractive design options.

With HSMtec, you can even design standard PCBs to a three-dimensional layout.

The use of HSMtec will streamline your workflows and costs.

Since HSMtec replaces several of your PCBs and cable and connector systems by a single compact PCB, your efforts in logistics, procurement, fabrication and quality assurance will be reduced to give you the decisive advantage in your total cost calculation compared to alternative technologies.

HSMtec increases the energy efficiency and environmental acceptability of your application as HSMtec takes away heat from your electronic components thus decreasing the power dissipation of high-current tracks. This results in a lower heating of your system and may require less cooling effort. With HSMtec, you will also purchase a product which is fabricated with a particularly low impact on resources compared to alternative technologies.

• Qualified and established technology (tested by independent institutes)
  
• Reduces overall costs (logistics, procurement, fabrication, quality assurance)
  
• Costs less than alternative technologies
  
• Increases the reliability of your application
  
• Increases the efficiency factor of assemblies and systems
  
• Increases the lifetime of power assemblies and systems
  
• Reduces weight and volume
  
• Offers innovative, multidimensional design options
  
• Great freedom of design and simple layout
  
• Standard processes for fabrication and finishing

Innovative LED lights

(excellent luminous efficacy through multidimensional alignment of the LEDs and white printed board surface, low energy and maintenance costs, long lifetime, heat dissipation and, for example, self-adjusting light dimming control on a single board)

• Inverters for photovoltaics
  
• Controlling of rotor blades (wind generators, turbines)

• Hybrid drives, electric drives
  
• Energy storage (cell connector board, control, etc.)
  
• Energy distribution (controlling consumer load)

• Motor controls
  
• Converters
  
• Power amplifiers

Contact our experienced team to support you even in the development and design phase of your project. Our staff of the competence center for high current and heat management will be happy to assist you:

• Layout consulting: design proposals for your PCB with high current and heat dissipation requirements
  
• Creating the layout
  
• Project-related calculation and simulation of high current and heat management on the job
  
• Practical simulation with current generator and thermographic camera
  
• Project-related calculation of impedance, multilayer stackups and microvias on the job