HSMtec

High current, thermal management and multidimensionality of PCBs.

HSMtec allows large copper cross-sections in the form of profiles or wires to be selectively embedded into standard FR4 PCBs. In this way, fine conductor structures can be combined, easily and cost-effectively, with high current connections and efficient thermal management for power components on a single board. The integration of embedded thick copper pieces also provides the ideal basis for the implementation of multidimensional PCB structures, thus reducing system costs.

 

HSMtec demo

 

Manufacturing process

The copper wires or profiles are bonded with the etched conductive pattern of the individual layers by means of a patented ultrasound method, to form a solid material connection. This allows for easy integration within a standard multilayer manufacturing process with subsequent compression of the individual layers. Copper elements with variable widths between 2 and 12 mm and individual lengths offer the greatest degree of flexibility in the high current layout and thermal design of the PCB. This allows a significant improvement in performance to be achieved, even with existing PCB designs.

 

Proven quality for the highest demands

  • HSMtec PCBs meet IPC A 600 class 2 and 3
  • Processes approved in accordance with: DIN EN 60068-2-14; JEDEC A 101-A
  • Audited for automotive and aviation applications
  • Tested by independent institutes
  • UL listing file no. E72795 for USA and Canada

 

Cost-effective solutions with easy handling

  • Reduced system costs (logistics, procurement, assembly, quality assurance)
  • Standard processes in production and further processing
  • Easy implementation in the standard layout process
  • Increased efficiency and service life of components
  • Increased reliability through the replacement of plug and cable connections, bus bars, etc.
  • Reduced space requirement, weight and volume of the module

 

HSMtec specification

HSMtec is based on standard FR4 materials. As a result, a wide range of PCB solutions are available. Take a look and see the benefits for yourself!

 

Technology

Materials

  • High current, thermal management and 3D PCB
  • FR4

PCB thickness

Final copper

  • 0.8 mm - 3.4 mm
  •  35 µm - 140 µm 

Conductor track widths

Minimum drilling diameter

 

  • 125 µm (standard)
  • 100 µm (by agreement)
  • 0.2 mm

 

Solder masks

Contour production

 

  • Photosensitive solder mask systems
  • UV solder mask system, screen printing
  • Milling
  • Scoring

 

Surfaces

Additional printing

 

  • Chemical nickel/gold
  • Chemical tin
  • Electroplated nickel / gold
  • Identification printing / Inkjet
  • Component printing / screen printing
  • Through-hole printing
  • Peelable solder mask (blue mask)
  • Masking tape

 

Number of layers

Bending radii and bending cycles by

agreement

 

  • 2 - 8

 

 

 

Your route to Häusermann HSMtec PCBs

Our team will provide you with straightforward, expert and active support in the implementation of your application, to ensure that your requirements are met, both technically and economically.

 

  • Creation of an individual concept based on your requirements
  • Implementation of the layout in the standard process
  • Support in the design, dimensioning and concept selection of your PCB
  • Thermal measurement and analysis